Offers a step-by-step guide on the practical thermal design taking resistors as an example.
Session 1 to 3 provides the necessary and sufficient knowledge as to the paradigm shift of the thermal design and the consequential shift in the thermal management of electronic components.
1. Paradigm Shift in Thermal Design
The paradigm shift in thermal design in electronic devices has been instigated by the downsizing and higher power rating of the devices which has been achieved by the technological advancement in semiconductors.
Concurrently, resistors has been transitioning, shifting from the leaded type to the SMD type, which caused a shift in the heat dissipation mechanism of resistors.
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2. Contributing factors in Temperature Rise of Flat Chip Resistors
The concept of surface power density, one of the most essential factors in thermal design for resistors, is explained.
As the power rating has been increasing rapidly more attention needs to be paid to the thermal design of PCBs. There is a material which will make you be aware of the horrible consequence of the inadequate substrate thermal design...
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3. Thermal Design Utilizing PCB
The differences in the structure and temperature distribution between leaded resistors and flat chip resistors are explained.
The temperature of flat chip resistors are mainly influenced by the heat dissipation capability of PCBs. KOA is proposing the derating curve based on the terminal part temperature for specifying the temperature of components that dissipates heat mainly through PCBs.
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